[email protected]
+8618024750627

Custom EMI/RFI Shield Stamping Services

We manufacture precision stamped metal shielding and board level EMI/RFI shielding components with multi-zone signal isolation for high-frequency signal isolation in automotive, telecommunications, and aerospace electronics at our precision manufacturing facility. Our IATF 16949 certified precision metal stamped parts workflows operate under strict process controls to deliver ±0.01mm coplanarity, guaranteeing absolute structural flatness across single and multi-cavity board level EMI RF shield configurations. This eliminates SMT reflow soldering defects (such as cold solder joints) and RF leakage.

Request DFM Evaluation
kravzik-stamped-emi-rfi-shield-parts-components
  • ±0.01mm Coplanarity Control
  • 0.05mm Minimum Thickness
  • 100% Automated Inspection
  • 16949 IATF Certified
  • Production-Ready Components

    Precision Board-Level EMI/RFI Shield Applications

    Custom emi rfi shielding components engineered for structural co-planarity and clear attenuation performance. We stamp board level emi shielding layouts from ultra-thin conductive alloys to isolate high-frequency component arrays, block cross-interference, and maximize SMT reflow manufacturing yields.

  • Telecommunications

    SMT-compatible EMI shielding cans engineered for telecom metal stamping applications. They maintain continuous, low-resistance grounding to eliminate high-frequency signal degradation between adjacent channels in dense base stations and routing hardware.

    Typical Parts:

    Base station shields, router EMI cans, transceiver shielding clips, RF amplifier board shields, gateway pcb shields.

  • Consumer Electronics

     

    EMI shielding layouts optimized for high-density consumer electronics and high-speed SMT assembly. Our custom PCB shield frames balance localized thermal dissipation with high-frequency wave reflection, often integrated with copper busbars in power management modules.

    Typical Parts:

    Smartphone shields, tablet EMI covers, wearable device cans, laptop shielding frames, camera module shields, smartwatch pcb covers, WiFi router shields.

  • Semiconductor

    EMI shielding layouts optimized for high-density consumer electronics and fast SMT assembly. Manufactured for consumer electronics where miniaturization demands sub-0.05mm material thickness, our custom PCB shield frames manage localized thermal dissipation and high-frequency wave reflection, often integrated with copper busbars in power management modules.

    Typical Parts:

    Microprocessor shields, IC packaging cans, sensor module covers, memory chip shields, ASIC shielding cans, RFIC enclosures, MEMS shielding caps.

  • Aerospace & Aviation

    Precision component isolation engineered to protect sensitive microprocessors, memory arrays, and integrated circuits. Our high-accuracy stamped metal shielding paths prevent micro-cavity crosstalk and secure strict signal path boundary conditions, manufactured to interface with lead frames in complete IC packaging solutions.

    Typical Parts:

    Avionic board-level shields, radar sensor enclosures, flight controller board shields, satellite PCBA module cans.

  • Medical & Healthcare

    High-attenuation stamped shielding designed for critical medical diagnostics and low-frequency imaging hardware. Engineered to control external electromagnetic noise floor profiles and safeguard precision sensor readout stability, these components are produced under strict process controls for medical applications where signal integrity directly impacts patient safety.

    Typical Parts:

    MRI RF balun shields, pacemaker module enclosures, ultrasound circuit board covers, medical sensor pcb shields, biosensor shielding cans.

  • Automotive EV & E-Mobility

    Rugged automotive shielding architectures designed for high-voltage power electronics and autonomous driving modules. Isolates harsh high-power switching noise from low-voltage vehicle networks, protecting adjacent radar, LiDAR, and telematics systems.

    Typical Parts:

    ADAS sensor shields, infotainment board level shields, BMS pcb shields, LiDAR module cans, radar sensor frames, inverter control board shields, EV telematics shields, V2X antenna shields.

  • Do not see your specific component here? From ultra-fine pitch microelectronic packaging layouts to high-current power grids, we provide custom progressive tool engineering for complex electronic profiles within our metal stamping products lineup. Submit your dimensional schematics for an initial DFM evaluation to align your technical requirements with our manufacturing capabilities and receive a production-ready quote.

    Request DFM EvaluationAccess Industry Database
    CRITICAL PRODUCTION RISKS

    Critical Risks in Precision EMI/RFI Shield Stamping

    Manufacturing ultra-thin stamped EMI shields requires strict mechanical process control. Microscopic deviations during die stamping introduce severe assembly bottlenecks, electromagnetic performance degradation, and board-level failures.

    • Risk #1: Coplanarity Deviation & SMT Soldering Defects

      High-speed stamping of ultra-thin alloys (under 0.15mm) releases internal material stresses, causing micro-warping. During high-density PCB automated pick-and-place operations, uneven shield profiles fail to establish flush contact with the screen-printed solder paste traces.

      Consequence: Elevated SMT reflow rejection rates, including component tombstoning, cold joints, and open circuits that require manual rework, slowing down production.

    • Risk #2: Edge Burrs & Radio Frequency (RF) Leakage

      Sub-optimal punch-to-die clearances or delayed tool maintenance create microscopic burrs along the shield’s stamped borders and ventilation apertures. These irregular edge geometries prevent a continuous, conductive perimeter seal against the PCB trace.

      Consequence: Degraded attenuation performance and severe RF leakage. Detached metallic micro-flakes also risk migrating across high-density circuit spaces, causing short circuits.

    • Risk #3: Corner Thinning & Fissures in Deep-Drawn Cans

      Forming deep-drawn or multi-cavity shielding cans over-stretches sheet metal beyond its elastic limits. Mismanaged grain directions and uncalibrated bend allowances create localized thinning and micro-cracking at corner junctions.

      Consequence: Compromised Faraday cage isolation, where microscopic fissures act as slot antennas. Weakened corner walls also suffer mechanical collapse under automated SMT vacuum-nozzle pressure.

    Precision engineering requires more than machine capacity; it demands a technical partner capable of managing the complex manufacturing requirements. Our case studies demonstrate how we have solved critical manufacturing challenges across multiple OEM supply chains.

    Tier 1 Manufacturing

    High-Performance Stamping Solutions for EMI/RFI Shield Manufacturing

    We mitigate high-frequency attenuation drop-off through predictive tool engineering and quantitative process controls. By pairing custom progressive die tooling with in-line stress-relief stages, Kravzik delivers flat, burr-free board-level shielding cans optimized for high-volume automated SMT setup.

    • Stress-Relief Stamping & Coplanarity Control

      Internal material stress in thin conductive alloys is neutralized using built-in micro-leveling blocks within the high-speed progressive die stamping progression. This stabilization locks the horizontal profile and controls planar alignment before final part cutoff.

      Sub-0.01mm Coplanarity: Prevents uneven solder paste compression and eliminates board-level SMT reflow component tombstoning.
      Tension Neutralization: Eliminates dimensional drift and post-stamping springback in micro-pitch stamped metal shielding components.

    • Zero-Burr Micro-Clearance Tooling

      To protect Faraday cage electrical continuity, we run custom wire-EDM processed tungsten carbide progressive die tooling. Tight die clearances and structured tool-dressing schedules eliminate localized fractures along internal partitions and ventilation holes.

      Tungsten Carbide Tooling: Prevents edge flaking, structural micro-fissures, and loose conductive shard contamination.
      Precision Perimeters: Enhances surface contact along the PCB ground trace for high emi shielding effectiveness.

    • FEA Flow Simulation & Deep-Draw Durability

      Finite Element Analysis (FEA) is executed during the DFM phase to prevent localized fracture boundaries in deep-drawn shielding cans. This mapping identifies uniform sheet metal displacement, establishes ideal draw ratios, and controls grain orientation across multi-cavity boundaries.

      Thinning Analysis: Prevents material micro-tearing and excessive drawing stress at tight internal corner fillets and draft angles.
      Rigid Sidewalls: Enhances component stiffness to withstand automated high-vacuum SMT nozzle pickup pressures without geometric bowing.

    • In-Line Optical Inspection & Tape-and-Reel Packaging

      High-resolution vision sensor arrays are embedded within the stamping line to perform dimensional logging at full production speeds, fully supported by our iatf 16949 quality management system. Verified shielding frames are automatically nested directly into embossed carrier tapes configured for standard assembly feeders.

      100% Automated Optical Inspection (AOI): Tracks dimensional stability and planar tolerances across full rfi shield production runs.
      SMT-Ready Carrier Tape: Protects critical micro-tolerances during transit and optimizes automated nozzle picking speed on the assembly line.

    Integrated Production Capabilities for Custom EMI/RFI Shields

    We integrate advanced progressive die tooling, automated metal stamping, and localized secondary finishing under a unified IATF 16949 operational footprint. Whether executing consigned processing using client-specified metal coils or managing a turnkey contract supply path from raw metallurgical sourcing to SMT-ready carrier reel packaging, our manufacturing cells support complex stamped shielding layouts while preserving micro-tolerance dimensional stability and guaranteed emi shielding effectiveness.

    PRECISION ALLOY MATRIX

    Engineered Metals for High-Frequency EMI/RFI Isolation

    Material metallurgy dictates attenuation performance and SMT assembly yields. Whether you provide customer-specified raw material coils for consigned processing, or leverage our end-to-end turnkey supply chain from raw mill sourcing to finished component output, Kravzik maintains strict metallurgical control. Drawing from our full stamping metals and alloys inventory, we process ultra-thin conductive alloys and high-permeability substrates down to 0.05mm thickness, engineered to minimize stress-induced warping and optimize board level emi shielding effectiveness.

    • Nickel Silver (Alloy 770 / UNS C77000)

      UNIVERSAL SMT SHIELDING STANDARD

      The universal standard for custom pcb emi shield cans requiring continuous grounding and absolute flatness without the added cycle times or flaking risks of secondary electroplating.

      SMT Reflow Flatness

      Neutralizes internal strip tension to keep horizontal coplanarity within ±0.01mm, eliminating reflow solder voids and automated component tombstoning.

      Oxide-Free Grounding

      Naturally resists atmospheric oxidation, humidity, and chemical tarnishing, maintaining low surface contact resistance across long deployment lifetimes.

      Deep-Draw Elasticity

      Micro-yield profile allows precise stamping and sharp drawing of complex multi-cavity board level emi rf shield geometries down to 0.10mm wall thicknesses without micro-fracturing.

    • Tin-Plated Cold Rolled Steel (Tin-Plated CRS)

      Tin-Plated Cold Rolled Steel (Tin-Plated CRS)

      Provides robust mechanical durability and targeted low-frequency magnetic attenuation, combining strong physical shield structures with cost-effective reflow soldering compatibility.

      H-Field Permeability:

      Calibrated relative magnetic permeability engineered specifically to absorb, redirect, and attenuate low-frequency electromagnetic interference fields.

      02. Solder-Paste Affinity:

      Uniform pre-plated tin layer guarantees immediate wetting balances and smooth reflow pasting right off the press line, avoiding post-stamping plating cycles.

      03. Structural Draw Ratio:

      Excellent material elongation allows for deep-drawn stamped rf shield cans with uniform wall thicknesses and burr-free perimeter cuts.

    • Stainless Steel (301 / 304 / 316 Series)

      EXTREME ENVIRONMENTAL DURABILITY

      An exceptionally high-tensile alloy choice for thin-walled Faraday cages demanding flawless structural survival under intense vibration, high temperatures, and chemical exposure.

      Micro-Gauge Rigidity:

      Extreme tensile boundaries allow stamping thin-walled shield profiles down to 0.05mm that resist physical bowing under automated SMT vacuum-nozzle suction.

      Thermal & Chemical Inertness:

      Total immunity to extreme automotive under-hood thermal cycles, industrial tarnish, salt spray, and corrosive environments.

      Laser-Welding Adaptation:

      Uniform metallurgical grain alignment optimized for micro-fissure-free automated laser welding, robotic assembly, and clean structural staking.

    • Beryllium Copper (BeCu - Alloy 25 / 190)

      HIGH CONDUCTIVITY & SPRING FORCE

      The premium choice for copper EMI shielding combining maximum conductivity with extreme fatigue life for spring clips and snap-on enclosures. High spring temper ensures uniform contact pressure across thousands of cycles without losing coplanarity. Available in copper alloy tempers from annealed to full-hard.

      Spring Fatigue Resistance

      High spring temper ensures uniform contact retention pressures across thousands of clip-on insertion and removal cycles without losing coplanarity.

      Electrical Conductance

      Voluntary conductivity metrics maximize near-field reflection and attenuation performance across high-frequency 5G and microwave telecom modules.

      Heat-Treat Stabilization

      Intricately stamped and coiled in a ductile, annealed state before undergoing precision age-hardening heat treatments to lock in complex spring features.

    • Mu-Metal (Nickel-Iron Permalloy)

      LOW-FREQUENCY H-FIELD ATTENUATION

      Specialized high-permeability shielding metal engineered to absorb low-frequency magnetic interference fields in highly sensitive audio modules, sensors, and diagnostic electronic enclosures.

      Ultimate Magnetic Attenuation

      Maximizes low-frequency shielding effectiveness against persistent magnetic stray fields that standard non-ferrous alloys cannot deflect.

      Stress Sensitivity Management

      Stamped using precise progressive tool tracking to prevent micro-structural dislocations that degrade native magnetic path boundaries.

      Crystal Structure Annealing

      Calibrated for post-stamping high-temperature hydrogen atmosphere annealing to re-align internal grain structures and achieve peak permeability.

    • Phosphor Bronze (Alloy 510 / C51000)

      BALANCED CONDUCTIVITY & FORMABILITY

      Delivers highly predictable springback behavior, reliable electrical performance, and high stress-relaxation resistance for internal clip frames and multi-axis grounding contacts.

      Springback Control

      Predictable elastic recovery ensures precise geometric control and sharp tolerances when forming complex multi-axis internal shielding clips.

      Stress-Relaxation Resistance

      Maintains continuous physical clamping force and tight contact resistance over extended periods under continuous thermal loads.

      Electroplating Receptivity

      Smooth surface chemistry flawlessly integrates with raw continuous reel-to-reel plating lines for selective nickel, tin, or precious metal finishes.

    Request DFM EvaluationAccess Material Database
    MANUFACTURING CAPABILITIES

    Integrated Production Capabilities for Custom EMI/RFI Shields

    We integrate progressive die tooling, automated metal stamping, and secondary finishing under a unified IATF 16949 footprint. Supporting complex stamped shielding layouts, our manufacturing cells preserve micro-tolerance stability and guaranteed EMI shielding effectiveness. We handle both consigned processing with client-specified coils and turnkey contract supply—from raw material sourcing to SMT-ready carrier reel packaging.

    We execute complex custom emi shielding geometries directly within the high-speed progressive stroke to minimize secondary handling deformation, preserve structural boundaries, and optimize board-level coplanarity.

    Frame and Lid Geometries: High-volume output of two-piece detachable pcb emi shield frame and lid configurations using precise, repeatable mechanical interlocking tabs.

    Multi-Compartment Forming: Continuous micro-stamping of multi-cavity board level emi rf shield internal partitions from a single strip layout using multi-stage drawing, bending, and folding die stations.

    Contact & Venting Features: Integrated tip coin profiling, countersunk holes, structural dimpling, and precision emi shielding honeycomb vents that balance thermal airflow with absolute signal isolation.

    Surface conditioning lines are calibrated to protect shielding metals against galvanic corrosion, control contact resistance boundaries, and ensure exceptional wetting indexes during automated SMT reflow soldering.

    Ultrasonic Cleaning & Degreasing: Automated multi-stage chemical washing to deliver hydrocarbons-free, pristine metal surfaces, eliminating trace lubrication oils that risk triggering SMT paste non-wetting.

    Selective Functional Plating: High-speed continuous reel-to-reel, selective spot, or barrel electroplating lines using copper, nickel, pure tin, or silver to optimize electrical conductance and grounding loops — delivered through our industrial surface finishing services for application-specific corrosion protection and solderability.

    Conductive Protective Coverings: Precision application of specialized emi rfi shielding coatings, thin-film passivation treatments, and anti-corrosion barrier layers to maintain peak low frequency emi shielding attenuation under severe operational humidities.

    For hybrid and multi-component shielding systems, our assembly cells synchronize hardware insertion and multi-material integration without generating localized thinning or micro-cracking in the parent stamped component matrix.

    Grounding Pins & Clips: Automated mechanical staking, in-die hardware insertion, and robotic feeding lines to integrate compliant pins (eye-of-the-needle), threaded fasteners, or clip on board level emi rf shield grounding contacts.

    Mechanical Interlocking: Integrated orbital riveting, clinch joining, tox locking, and precision embossing to secure multi-part enclosures subject to continuous structural vibration spectrums.

    Turnkey Hybrid Integration: Streamlined coordination with our internal precision injection cells to support plastic injection molding with emi/rfi shielding, directly bonding stamped metal shield walls with engineered polymer enclosures — a natural extension of our metal assemblies capability for multi-material component consolidation.

    PRODUCT APPLICATIONS

    Industries Served

    Access expert technical guidance to optimize your component designs and resolve manufacturing challenges. Our engineering resources cover critical material selection, tolerance control, and failure prevention to ensure reliable performance in your specific application — backed by documented case studies.

    kravzik-automotive-busbar-power-connectors

    EV Metal Stampings

    Learn More
    kravzik-automotive-busbar-power-connectors

    Plastic-Metal Stampings

    Learn More
    kravzik-energy-solar-panel-mounting-brackets

    Solar

    Learn More
    kravzik-packaging-logistics-precision-manufacturing-solutions

    Logistics

    Learn More
    kravzik-semiconductor-precision-manufacturing-solutions

    Semiconductors

    Learn More
    kravzik-medical-device-precision-manufacturing-solutions

    Medical

    Learn More
    kravzik-consumer-electronics-precision-manufacturing-solutions

    Consumer Electronics

    Learn More
    kravzik-aerospace-aviation-precision-manufacturing-solutions

    Aerospace

    Learn More
    kravzik-energy-power-precision-manufacturing-solutions-2

    Energy

    Learn More
    kravzik-military-defense-precision-manufacturing-solutions

    Defense

    Learn More
    • MANUFACTURING CAPABILITIES

      Metal Stamping & Die Tooling

      Engineered for high-volume reliability and critical automotive tolerances. Leveraging our ultra-precision tooling backbone—powered by simultaneous CNC, Wire EDM, and PG grinding—we build elite high-speed progressive dies and precision compound tooling to guarantee strict ±0.01mm accuracy. Our in-house tool room designs and builds custom progressive die tooling optimized for high-volume assembly production, ensuring long die life and tight tolerances. From heavy-gauge structural brackets to intricate electrical terminals & contacts, we provide a true end-to-end stamping ecosystem. Our unique integrated manufacturing advantage seamlessly bridges pure metal stamping with advanced insert molding operations under one roof, delivering a unified, single-source solution from raw alloy selection to final surface treatment.

      Learn More
    • MANUFACTURING CAPABILITIES

      Precision Metal Stamped Parts & Assemblies

      Engineered for critical conductivity and uncompromising structural integrity. As an IATF 16949 certified manufacturer, we specialize in high-volume custom precision metal stamping parts that demand strict tolerances. Powered by state-of-the-art 35T and 50T precision presses and a sub-micron in-house tooling ecosystem, we expertly process high-performance copper alloys, stainless steel, and specialty metals. Our capabilities span a comprehensive portfolio, including micro-precision electrical terminals, lead frames, robust stamped metal brackets, and EMI/RFI shields. Moving beyond standard stamping parts manufacturers, we combine these stamped metal components with seamless in-house insert molding integration, delivering true one-stop, zero-defect assemblies for your most complex engineering challenges.

      Learn More
    TECHNICAL SUPPORT

    Engineering Solutions & Design Insights

    Access expert technical guidance to optimize your component designs and resolve manufacturing challenges. Our engineering resources cover critical material selection, tolerance control, and failure prevention to ensure reliable performance in your specific application.

    kravzik-high-precision-stamped-electrical-terminals (8)

    Before Plating Batch: Stamped Electrical Terminals Finish Audit Checklist

    A supplier who plates your terminals but skips the JESD201 post-plating anneal will pass the incoming dimensional check. You discover tin whiskers only after field returns arrive. This checklist audits plating specification, pre-treatment protocols, and post-plating verification. Go through every item.

    Learn More
    kravzik-high-precision-stamped-electrical-terminals (23)

    Before PPAP Submission: Stamped Electrical Terminals Compliance Audit Checklist

    A PPAP package submitted with a compliance letter but without the Cpk capability study will pass the document checklist and fail the customer SQE review. This checklist audits dimensional capability data, material cert traceability, and testing standards documentation before the submission package leaves your supplier. Go through every document.

    Learn More
    kravzik-high-precision-stamped-electrical-terminals (45)

    Before Die Design: Stamped Electrical Terminals DFM Readiness Checklist

    A terminal drawing that passes CAD review but lacks springback compensation data will drift out of tolerance by stroke 50,000. Your supplier catches it only at first-article rejection. This checklist audits flat blank layout, bend radii, and material grain alignment before die steel is cut. Go through every item.

    Learn More
    kravzik-high-precision-stamped-electrical-terminals (34)

    Before Tooling Cut: Stamped Electrical Terminals Supplier Audit Checklist

    A missed JESD201 anneal on your terminal lot triggers PPAP rejection, and you catch it only at the compliance audit. This checklist verifies DFM sign-off, material certs, and compliance docs before tooling cut. Go through the full audit.

    Learn More
    kravzik-high-precision-stamped-electrical-terminals (49)

    Production-Scale Consistency: Appliances Stamped Electrical Terminals Engineering Guide

    A washing machine control board terminal passing factory testing fails after 2,000 cycles when the crimp joint relaxes. In this guide, you will learn cost-optimized material selection and UL 60335 compliance. Read the full guide.

    Learn More
    kravzik-high-precision-stamped-electrical-terminals (39)

    USCAR-Validated: Automotive Stamped Electrical Terminals Engineering Guide

    An ECU stamped terminal passing testing at 25°C fails after 1,000 thermal shock cycles from -40°C to +125°C. In this guide, you will learn USCAR-2 contact stability and IATF 16949 PPAP. Read the full guide.

    Learn More
    SERVICES LIBRARY

    Explore Other Stamped Parts Available

    kravzik-stamped-lead-frame-parts-components

    Lead Frame

    Kravzik is an IATF 16949 certified lead frame manufacturer. We deliver high precision stamped lead frames and custom leadframe components with sub-micron pitch accuracy for dense IC packaging.

    Learn More

    Stamped Busbars

    Kravzik manufactures custom stamped & folded busbars from pure copper and aluminum alloys. IATF 16949 certified precision within ±0.02mm tolerances. View more!

    Learn More
    kravzik-stamped-electrical-terminals-contacts-parts-components

    Stamped Electrical Terminals

    Kravzik manufactures custom stamped electrical terminals from high-conductivity copper and bronze alloys. IATF 16949 certified & ±0.01mm precision. View More!

    Learn More
    kravzik-stamped-eyelet-wire-connector-parts-components

    Eyelet Wire Connector

    Stop high-voltage terminal overheating and mechanical crimp failures. We guarantee

    Learn More
    Request DFM EvaluationView Stamped Parts Center
    TECHNICAL REFERENCE

    Frequently Asked Questions

    Answers to common questions regarding precision, tooling, materials, and our integrated molding capabilities.

    We maintain a strict coplanarity tolerance threshold of ±0.01mm. Utilizing integrated in-die stress-relief leveling and 100 percent automated optical inspection (AOI), our process controls the horizontal seating profile to verify uniform solder paste compression, mitigating the risk of component tombstoning or open joints during automated reflow processes.

    Our progressive die lines routinely process thin-gauge conductive alloys down to 0.05mm thickness. This micro-stamping capability supports tight spatial configurations in high-density board level emi shielding layouts and miniaturized microelectronic packaging architectures where volumetric height constraints are strict.

    We run custom wire-EDM processed tungsten carbide progressive dies built with optimized punch-to-die micro-clearance ratios. This specific tooling layout prevents boundary edge fractures and material micro-flaking during high-speed shearing runs, delivering the smooth contact perimeters required for a continuous conductive seal and consistent emi shielding effectiveness.

    No. Nickel Silver (Alloy 770) features native solderability, allowing direct integration into high-volume surface-mount production lines. Utilizing raw nickel silver strips eliminates post-stamping electroplating cycles, reducing supply chain lead times and removing the risk of localized plating flaking inside sensitive board enclosures.

    Yes. Our production facilities undergo continuous independent auditing for full IATF 16949 certification. This operational system enforces comprehensive material heat traceability, documented SPC logging, and automated error-proofing to verify repeatable dimensional profiles across automotive emi shield stamping, medical, and telecom product lines.

    Stamped components are systematically nested directly into customized, embossed Tape-and-Reel (T&R) carrier pockets optimized for high-speed automated pick-and-place indexing heads. This packaging configuration isolates delicate shield walls from transport vibration, preventing edge deformation and maximizing assembly line pickup rates.

    Absolutely. Our engineering team conducts comprehensive Design for Manufacturability (DFM) analysis to neutralize potential assembly risks before investing in high-volume production tooling. This predictive evaluation ensures your custom emi shielding solutions transition smoothly from rapid prototyping into seamless, scalable progressive stamping runs.

    We deploy predictive Finite Element Analysis (FEA) software during the initial tool design phase to calculate precise bend allowances and establish progressive drawing steps. This simulation guides material flow along ideal metallurgical grain paths, limiting localized thinning and preventing micro-cracking across complex or multi-cavity board level emi rf shield configurations.

    Still have questions?

    Our engineering team loves solving complex problems. Chat with us or send your drawing for a review.

    Request DFM Evaluation

    Request DFM & Quote

    • Your files are securely processed. We respect your IP.

    We don’t just quote—we partner with you. Our engineering team proactively optimizes your design, eliminates hidden risks, and adds real value before production even begins.

    kravzik-brand-manager-ray-chan-pofile-image.jpg
    Ray ChanBrand Manager, Kravzik